Display device

ABSTRACT

According to one embodiment, A display device includes a first substrate includes an inorganic insulating film, a first wiring formed above the inorganic insulating film, an organic insulating film located above the inorganic insulating film and the first wiring, and a driver electrically connected to the first wiring, a second substrate opposing the first substrate, and a sealant fixing the first substrate and the second substrate, wherein the sealant comprises a first seal portion formed along a first edge of the first substrate and a second seal portion which crosses the first seal portion, and the first seal portion has a first width, and the second seal portion has a second width, the first width being greater than the second width.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2014-236449, filed Nov. 21, 2014, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a display device.

BACKGROUND

In recent years, display devices including liquid crystal displays, havebeen used in various fields. For example, in a liquid crystal displaypanel, a pair of substrates which sandwich a liquid crystal layer aremutually fixed by a sealant. Here, there has been a technique disclosed,in which an insulating film provided on an wiring group is partiallyremoved, and a pair of substrates are mutually fixed by the sealantwithout interposing the insulating film therebetween, in order toincrease the strength of adhesion between the substrates without causingan increase in frame size.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a structure and an equivalent circuit of adisplay panel, which is a part of a display device of this embodiment.

FIG. 2 is an enlarged diagram showing an area A of the display panelshown in FIG. 1 .

FIG. 3 is a cross-section of the display panel, taken along the line B-Cin FIG. 2 .

FIG. 4 is a diagram showing a first modification of this embodiment.

FIG. 5 is a diagram showing a second modification of this embodiment.

FIG. 6 is a diagram showing a third modification of this embodiment.

FIG. 7 is a schematic diagram showing a process of applying the sealant.

FIG. 8 is a diagram showing a fourth modification of this embodiment.

FIG. 9 is a schematic diagram showing a process of applying the sealant.

DETAILED DESCRIPTION

In general, according to one embodiment, a display device comprising: afirst substrate comprising an inorganic insulating film, a first wiringformed above the inorganic insulating film, an organic insulating filmlocated above the inorganic insulating film and the first wiring, and adriver electrically connected to the first wiring; a second substrateopposing the first substrate; and a sealant fixing the first substrateand the second substrate, wherein the sealant comprises a first sealportion formed along a first edge of the first substrate and a secondseal portion which crosses the first seal portion, and the first sealportion has a first width, and the second seal portion has a secondwidth, the first width being greater than the second width.

Embodiments will now be described with reference to accompanyingdrawings. Note that the disclosure is presented for the sake ofexemplification, and any modification and variation conceived within thescope and spirit of the invention by a person having ordinary skill inthe art are naturally encompassed in the scope of invention of thepresent application. Furthermore, a width, thickness, shape, and thelike of each element are depicted schematically in the figures ascompared to actual embodiments for the sake of simpler explanation, andthey do not limit the interpretation of the invention of the presentapplication. Furthermore, in the description and Figures of the presentapplication, structural elements having the same or similar functionswill be referred to by the same reference numbers and detailedexplanations of them that are considered redundant may be omitted.

First, a display device according to this embodiment will now bedescribed in detail.

FIG. 1 is a diagram showing a structure and an equivalent circuit of adisplay panel, which is a part of a display device of this embodiment.Note that this embodiment describes a case where the display deviceincludes a liquid crystal display panel, but the embodiment is notlimited to this. The display device may comprise, as a display panel, aself-luminous display panel such as of organic electroluminescence, oran electronic paper display panel of an electrophoretic element, or thelike.

Here, FIG. 1 shows a plan view of a display panel PNL in an X-Y planedefined in a first direction X and a second direction Y crossing witheach other. In this specification, the first direction X and the seconddirection Y are not limited to the directions indicated by arrows in thefigure, but directions may also be 180 degree opposite to thoseindicated by the arrows.

That is, the display panel PNL comprises an array substrate (firstsubstrate) AR, a countersubstrate (second substrate) CT arranged tooppose the array substrate AR, and a liquid crystal layer LQ heldbetween the array substrate AR and the countersubstrate CT. The arraysubstrate AR and the countersubstrate CT are mutually fixed with asealant SE, while forming a predetermined cell gap therebetween. Theliquid crystal layer LQ is held in the cell gap between the arraysubstrate AR and the countersubstrate CT at an inner side surrounded bythe sealant SE. The display panel PNL includes an active area (displayarea) ACT configured to display images, at the inner side surrounded bythe sealant SE. The active area ACT is, for example, substantiallyrectangular and comprises a plurality of pixels PX arranged in matrix.Note that the active area ACT may be polygonal other than rectangularand the edges thereof may be formed in a curved shape.

The array substrate AR comprises, in the active area ACT, gate lines Gextended along the first direction X, source lines S extended along thesecond direction Y, switching elements SW each electrically connected toa respective gate line G and a respective source line S in a respectivepixel PX, pixel electrodes PE each electrically connected to arespective switching element SW in a respective pixel PX, and the like.A common electrode CE is provided at least one of the array substrate ARand the countersubstrate CT.

Although a detailed explanation regarding the structure of the displaypanel PNL will be omitted, it should be noted here that in a displaymode which uses a vertical electric field along a normal of the majorsurface (X-Y plane) of the substrate, such as TN (twisted nematic) mode,OCB (optically compensated bend) mode or VA (vertical aligned) mode, orin a display mode which uses a tilted electric field inclined in anoblique direction to the major surface of the substrate, the pixelelectrodes PE are provided on the array substrate AR, whereas the commonelectrode CE is provided on the countersubstrate CT. Moreover, in adisplay mode which uses a lateral electric field along the major surfaceof the substrate, such as IPS (In-Plane Switching) mode, or FFS (FringeField Switching) mode, which is one of IPS modes, both of the pixelelectrodes PE and the common electrode CE are provided in the arraysubstrate AR. Further, the display panel PNL may have a structurecompatible with a display mode which utilizes the vertical electricfield, lateral electric field and tilted electric field in combinationappropriately.

Further, the display panel PNL may be constituted as a transmissive typepanel which displays images by selectively transmitting light from thebacklight unit arranged at the back side thereof, or as a reflectivetype panel which displays images by selectively reflecting outside lightentering the display panel PNL, or a transflective type panel which is acombination of the transmissive type and the reflective type.

Supply sources of signals required to drive the display panels PNL, suchas a drive IC chip 2 and a flexible printed circuit (FPC) board 3 arelocated in a peripheral area PRP (non-display area) outside the activearea (display area) ACT. In the example illustrated, the drive IC chip 2and the FPC board 3 are mounted in the mount unit MT of the arraysubstrate AR extending outward from a substrate end CTE of thecountersubstrate CT. The mount unit MT is formed along a substrate endARE of the array substrate AR. The mount unit MT comprises padselectrically connected to the signal supply sources, details of whichare not provided here. The pads include those electrically connected tothe gate lines, source lines, and the like. In the illustrated example,the other three substrate ends of the countersubstrate CT oppose theother three substrate ends of the array substrate AR. Note that themount unit MT may be formed not only in one substrate end of the arraysubstrate, but in two substrate ends or three or more substrate ends.Further, even if the array substrate is formed in other polygonal shape,the mount unit MT can be provided as described above.

The sealant SE is formed into a frame shape which encloses the activearea ACT. In the illustrated example, the sealant SE is formed into arectangular shape. That is, the sealant SE comprises a first sealportion SL1, a second seal portion SL2, a third seal portion SL3 and afourth seal portion SL4. The first seal portion SL1 and the fourth sealportion SL4 each extend along the first direction X and oppose to eachother across the active area ACT in the X-Y plane. The second sealportion SL2 and the third seal portion SL3 each extend along the seconddirection Y and oppose to each other across the active area ACT in theX-Y plane. The first seal portion SL1 is formed along the end of thefirst substrate. The second seal portion SL2 and the third seal portionSL3 cross the first seal portion SL1 respectively in both ends of thefirst seal portion SL1. The fourth seal portion SL4 crosses, by its bothends, the second seal portion SL2 and the third seal portion SL3,respectively. The first seal portion SL1 is formed to be wider than thesecond seal portion SL2, the third seal portion SL3 and the fourth sealportion SL4. As an example, a first width W1 of the first seal portionSL1 is greater than a second width W2 of the second seal portion SL2.The first width W1 is 1.5 to 4 times the second width W2, and shouldpreferably be 1.5 to 2.5 times the second width W2. Further, the firstwidth W1 is greater than a third width W3 of the third seal portion SL3.The first width W1 is greater than a fourth width W4 of the fourth sealportion SL4. The second width W2, the third width W3 and the fourthwidth W4 may be equal to or different from each other. Note that thewidth of a seal portion is that in a longitudinally central portion ofthe seal portion, or that in a central portion when each seal materialis longitudinal divided into three equal parts.

FIG. 2 is an enlarged diagram showing the area A of the display panelPNL shown in FIG. 1 . The area A illustrated is an area containing ancrossing portion CR where the first seal portion SL1 and the second sealportion SL2 cross in the sealant SE. Note that a structure similar tothat of the area A shown in FIG. 2 is applied also to the areacontaining the crossing portion where the first seal portion SL1 and thethird seal portion SL3 cross each other, shown in FIG. 1 , and thereforean explanation thereof is omitted.

In the illustrated example, a void 30, where the sealant SE is notextended, is formed in the crossing portion CR, but the void 30 maydisappear. Moreover, the dashed line drawn along the direction first Xfrom the void 30 indicates a boundary line 30L between sealant materialsapplied in two separate drawing processes. The boundary line 30Ldisappears as each sealant material spreads in the width direction andcures thereafter. Note that the sealant materials applied on both sidesof the boundary line 30L may be separated apart from each other. In sucha sealant SE, the first seal portion SL1 is formed to be wider than thesecond seal portion SL2. Note that the way to apply the sealant materialis not limited to drawing using a dispenser, but may be printing using aprinting plate or drawing using an ink jet. In this case, the boundaryline 30L may not be present.

The array substrate AR comprises an wiring group WG, a third insulatingfilm (organic insulating film, which will be described later) 13, andthe like. The wiring group WG includes a plurality of wirings WR1, WR2,. . . , arranged in a peripheral area PRP. In the illustrated example,the wiring WR1 is the outermost circumferential wiring formed closest tothe substrate end ARA of the array substrate AR. The wirings WR1, WR2, .. . , are electrically connected to the drive IC chip in the mount unitMT. The wiring WR1, WR2, . . . , are, for example, source lines and gatelines led out from the active area ACT to the peripheral area PRP, andvarious wirings to which control signals, clock signals, power supplies,etc. are supplied to the circuits formed in the peripheral area.

The third insulating film 13 is formed in a region overlaps the wiringgroup WG. In the illustrated example, the third insulating film 13 isformed to overlap with all the wirings of the wiring group WG includingthe outermost circumferential wiring. A groove 4 is formed in the thirdinsulating film 13. The groove 4 includes a first groove portion 4 a anda second groove portion 4 b. The first groove portion 4 a is formed inthe region which overlaps with the first seal portion SL1 along thefirst direction X. The first groove portion 4 a crosses the wirings WR1,WR2, . . . . The second groove portion 4 b is formed in the region whichoverlaps with the second seal portion SL2 along the second direction Y.The second groove portion 4 b is formed along the wiring WR1. The thirdinsulating film 13 includes a removed area 4E extended to a positionwhich opposes the substrate end CTE of the countersubstrate CT in thecrossing portion CR. The removed area 4E is a region where the thirdinsulating film 13 is not formed and is connected with the first grooveportion 4 a and the second groove portion 4 b. Note that the thirdinsulating film 13 may be formed in the removed area 4E. Here, the thirdinsulating film 13 in the removed area 4E is formed to be thinner thanthe third insulating film 13 in the active area.

In the illustrated example, the removed area 4E is extended to thesubstrate end ARA of the array substrate AR. Such a removed area 4E isformed into, substantially, a triangle shape, for example. An obliqueside 41 of the removed area 4E is extended along the wiring WR1, theoutermost circumferential wiring. A vertex angle 42 opposing the obliqueside 41 of the removed area 4E is located near the crossing of thesubstrate end ARA and the substrate end CTE. The third insulating film13 is not formed in the mount unit MT in a region where the drive ICchip 2 is arranged. The removed area 4E may be extended to a regionwhere the third insulating film 13 is not formed in the mount unit MT.

FIG. 3 is a diagram showing a section of the display panel PNL takenalong in the line B-C in FIG. 2 . Note that FIG. 3 mainly shows thestructure of the display panel PNL in the peripheral area PRP and omitsa detailed structure of the display panel PNL in the active area ACT.

The display panel PNL comprises the array substrate AR, thecountersubstrate CT opposing the array substrate AR and the liquidcrystal layer LQ held between the array substrate AR and thecountersubstrate CT. The array substrate AR and the countersubstrate CTare mutually fixed with the sealant SE in the peripheral area PRP.

In the explanation of the array substrate AR, the expression indicatingan “upward” direction is meant a side close to the countersubstrate CT.The array substrate AR comprises a first insulating substrate 10, afirst wiring 5, a second wiring 6, a first insulating film 11, a secondinsulating film 12, a third insulating film 13, a fourth insulating film14, a first alignment film AL1 and the like. The first insulatingsubstrate 10 is formed from a material such as glass or resin. The firstinsulating substrate 10 is covered by the first insulating film 11. Notethat some other insulating film, electrode, wiring, etc. may beinterposed between the first insulating substrate 10 and the firstinsulating film 11. The first wiring 5 is formed on the first insulatingfilm 11. In the illustrated example, the wiring WR2, wiring WR3 and thelike correspond to the first wiring 5. The second insulating film 12covers the first wiring 5 and the first insulating film 11. The secondwiring 6 is formed on the second insulating film 12. In the illustratedexample, the wiring WR1, wiring WR4 and the like correspond to thesecond wiring 6. The third insulating film 13 covers the second wiring 6and the second insulating film 12. The first wiring 5 and the secondwiring 6 are formed of metals, for example, molybdenum (Mo), tungsten(W), aluminum (Al) and titanium (Ti).

The first insulating film 11 and the second insulating film 12 areinorganic insulating films and formed of inorganic materials, forexample, silicon oxide (SiO) and silicon nitride (SiN). As mentionedabove, the third insulating film 13 is an organic insulating film andformed of an organic material, for example, one of various types ofresins. The third insulating film 13 is formed thicker than the firstinsulating film 11 or the second insulating film 12.

In the illustrated example, the first insulating film 11 and the secondinsulating film 12 are formed in substantially continuously from theactive area ACT over to the peripheral area PRP, and is extended to thesubstrate end 10E of the first insulating substrate 10. The thirdinsulating film 13 is interrupted by the groove 4 made through to thesecond insulating film 12 in the peripheral area PRP. That is, the thirdinsulating film 13 is separated into a first segment 131 located in thesubstrate end 10E side and a second segment 132 extended to the activearea ACT side in the peripheral area PRP. Note that the removed area 4Eshown in FIG. 2 is made through to the second insulating film 12 as sois the groove 4, although a detail explanation thereof is not provided.

A distance L between an end D on the groove 4 side of the outermostcircumferential wiring, the wiring WR1 and an end E facing the groove 4of the third insulating film 13 is set to, for example, 10 μm or more.

In the illustrated example, the fourth insulating film 14 is formed onthe third insulating film 13. The fourth insulating film 14 is aninorganic insulating film and formed of an inorganic material, forexample, silicon nitride (SiN). The fourth insulating film 14 may beformed substantially continuously from the active area ACT over to theperipheral area PRP as illustrated, and it may be formed only in theactive area ACT. For example, in the structure that the array substrateAR comprises pixel electrodes and a common electrode, the fourthinsulating film 14 is equivalent to an interlayer insulating filminterposed between the pixel electrodes and the common electrode. Notethat the fourth insulating film 14 may be omitted in a display modewhich uses a vertical electric field or a tilted electric field.

The first alignment film AL1 is formed on the fourth insulating film 14and disposed on a surface of the array substrate AR, which is in contactwith the liquid crystal layer LQ. In FIG. 3 , the end of a firstalignment film AL1 is located in a formation area for the sealant SE,but may be extended up to the substrate end 10E of the first insulatingsubstrate 10.

In the meantime, the countersubstrate CT comprises a second insulatingsubstrate 20, a light shielding layer BM, a color filter CF, an overcoatlayer OC, a second alignment film AL2 and the like. The secondinsulating substrate 20 is formed from a material such as glass orresin.

The light shielding layer BM is formed on a side of the secondinsulating substrate 20, which opposes the array substrate AR. Althoughnot explained in full detail, the light shielding layer BM is formed soas to define each pixel in the active area ACT. Further, the lightshielding layer BM is expanded substantially over the entirety of theperipheral area PRP. Note that in the illustrated example, the lightshielding layer BM comprises a slit 22. The slit 22 opposes, forexample, the wiring WR1. For example, the slit 22 is narrower than or aswide as the wiring WR1.

The color filter CF is formed in the active area ACT, on a side of thesecond insulating substrate 20, which opposes the array substrate AR andthe end thereof overlaps the light shielding layer BM. The color filterCF is formed of a colored resin material. Note that the color filter CFmay be provided on the array substrate AR.

The overcoat layer OC covers the color filter CF and the light shieldinglayer BM. The overcoat layer OC is formed of a transparent resinmaterial. The second alignment film AL2 is formed on a side of theovercoat layer OC, which opposes the array substrate AR, and disposed ona surface of the countersubstrate CT, which is in contact with theliquid crystal layer LQ.

In the illustrated example, the display panel PNL further comprises aspacer PS interposed between the array substrate AR and thecountersubstrate CT. The spacer PS is located in a region where thesubstrate end 10E of the first insulating substrate 10 and the substrateend 20E of the second insulating substrate 20 oppose each other. Forexample, the spacer PS is provided on the countersubstrate CT and isformed on a side of the overcoat layer OC, which opposes the arraysubstrate AR. An end of the spacer PS is in contact with the firstsegment 131 of the third insulating film 13. The spacer PS may be formedinto the shape of a wall extending continuously in a normal direction ofthe drawing, or a discontinuous wall, or dotted pillars. Further, thespacer SP may be formed on an array substrate AR side. Although thedrawings shows the spacer PS provided in the substrate end, some otherspacer PS may be provided in the active area ACT or the peripheral areaPRP.

The array substrate AR and the countersubstrate CT are mutually fixedwith the sealant SE. The sealant SE fills the groove 4 as well and it isbrought into contact with the upper and side surfaces of the thirdinsulating film 13 and also the second insulating film 12 exposed in thegroove 4. The liquid crystal layer LQ is sealed in between the firstalignment film AL1 of the array substrate AR and the second alignmentfilm AL2 of the countersubstrate CT.

According to this embodiment, the sealant SE comprises the first sealportion SL1 formed along the mount unit MT and the second seal portionSL2 which crosses the first seal portion SL1, and the first width W1 ofthe first seal portion SL1 is greater than the second width W2 of thesecond seal portion SL2. That is, a greater amount of sealant SE isapplied by the mount unit MT side of the peripheral area PRP, which doesnot contribute to display. For this reason, it is possible to suppressthe reduction in the strength of adhesion of the seal formed by thesealant SE. Therefore, detachment of the sealant SE is suppressed and adisplay device with an improved reliability can be provided.

Moreover, since the strength of adhesion of the seal by the sealant SEis ensured in the first seal portion SL1 set along the mount unit MT, aportion of the sealant SE other than the first seal portion SL1 can bemade narrower than the first seal portion SL1. That is, in theframe-shaped peripheral area PRP, the sides other than that along themount unit MT can be narrowed, and therefore, the frame portion can benarrowed. According to an example, in a display device having a narrowframe in its specification in which the width of the sides other thanthat along the mount unit MT was set to 1 mm or less, a sufficientstrength of adhesion of the seal formed by the sealant SE is ensured.

Further, according to this embodiment, the groove 4 is formed in thethird insulating film 13, which is an organic insulating film of thedisplay panel PNL. With the groove thus formed, the contact area betweenthe sealant SE and the array substrate AR is increased, and the strengthof adhesion of the seal by the sealant SE can be increased. Or, when thegroove 4 of the third insulating film 13 is made through to the secondinsulating film 12, which is an inorganic insulating film, the sealantSE adheres not only to the third insulating film 13 but also the secondinsulating film 12 in the groove 4. As shown in FIG. 3 , the arraysubstrate AR has a multi-layered structure in which the secondinsulating film 12 of an inorganic material and the third insulatingfilm 13 of an organic material are stacked. In the interface between aninorganic insulating film and an organic insulating film as such, thepossibility of occurrence of detachment is high as compared to the caseof a multi-layered structure of an inorganic insulating film and aninorganic insulating film or that of an organic insulating film and anorganic insulating film. Therefore, the sealant SE directly adheres notonly to the third insulating film 13, an organic insulating film, butalso the second insulating film 12, an inorganic insulating film, andthus it is possible to suppress the detachment in the interface betweenthe second insulating film 12 and the third insulating film 13.Consequently, it becomes possible to further strengthen the adhesion ofthe sealant SE to the array substrate AR.

Note that the countersubstrate CT has a multi-layered structure thatorganic insulating films such as the overcoat layer OC and the lightshielding layer BM are stacked, there is a tendency that the detachmentin the interface between layers does not easily occur.

Further, the third insulating film 13 comprises, in the crossing wherethe first seal portion SL1 and the second seal portion SL2 cross, theremoved area 4E connected with the groove 4 and made through to thesecond insulating film 12. The removed area 4E is extended to thesubstrate end CTE of the countersubstrate CT. That is, in the removedarea 4E, the area in which the sealant SE is in contact with the secondinsulating film 12 is expanded, and therefore it becomes possible tofurther strengthen the adhesion between the array substrate AR and thecountersubstrate CT with the sealant SE. In particular, when the removedarea 4E is formed in a triangle shape and its oblique side is extendingin the wiring direction of the wiring group WG of the peripheral areaPRP, it is possible to expand the adhesion area between the sealant SEand the second insulating film 12 while most of the wiring group WG iscovered by the third insulating film 13.

According to this embodiment, the third insulating film 13 is divided bythe groove 4 into the first segment 131 on the side of the substrate end10E and the second segment 132 on the side of the active area ACT. Thethird insulating film 13, which is an organic insulating film, may beformed of a material having a water permeability higher than that of theinorganic insulating film. Even in such a case, because of the groove 4of the third insulating film 13, the permeation path of moisture isblocked and it is possible to suppress entering of moisture whichproceeds from the exterior of the display panel PNL towards the activearea ACT. Therefore, it is possible to suppress the occurrence oftroubles (for example, degradations of the liquid crystal material,wirings, etc.) caused by the entering of moisture.

Moreover, in the example shown in FIG. 3 , the light shielding layer BMcomprises the slit 22. With this structure, even if the light shieldinglayer BM is formed of a material having high water permeability, theentering of moisture from an exterior of the display panel PNL can besuppressed with the slit 22 of the light shielding layer BM. Note that,within the wiring group WG of the array substrate AR, at least onewiring (wiring WR1 in the example shown in FIG. 3 ) opposes the slit 22of the light shielding layer BM, and with this structure, the leakage ofthe light irradiated from a lower part of the array substrate AR can besuppressed.

Further, according to this embodiment, the spacer PS is interposedbetween the array substrate AR and the countersubstrate CT in theperipheral area PRP. For this reason, it becomes possible to maintainthe gap between the array substrate AR and the countersubstrate CT inthe peripheral area PRP. Furthermore, the display panel PNL, whichcomprises the array substrate AR and the countersubstrate CT, ismanufactured, for example, by attaching together a first motherboard forpreparing a number of array substrates AR and a second motherboard forpreparing a number of counter substrates CT with the sealant SE, andthen cutting it. Here, the spacer PS is provided in each of the cutlines of the first motherboard and the second motherboard, and with thisstructure, the sealant SE is hardly present in the cut lines. For thisreason, the external stress applied during the cuttings, concentratestoward the spacer PS, which makes it possible to suppress cutting errorof the motherboards. Moreover, the sealant SE is hardly provided at theposition along each cut line, each cut piece of display panel PNL can beeasily separated.

Moreover, according to this embodiment, the distance L between the end Dof wiring WR1, the outermost circumferential wiring, and the end E ofthe third insulating film 13 is set to 10 μm or more. With the groove 4,the permeation path of moisture is blocked, which makes it possible tosuppress the effect on the wiring WR1 by the moisture from outside.Further, the wiring WR1 is covered by the third insulating film 13, acomparatively thick film, and therefore the wiring WR1 can be protectedfrom constituents (for example, fibers) of the sealant SE while thearray substrate AR and the countersubstrate CT are subjected to contactbonding.

When the outermost circumferential wiring is covered by the secondinsulating film 12, which is an inorganic insulating film, the thirdinsulating film 13 is not necessarily placed in a position overlappingthe outermost circumferential wiring. In order to prioritize thenarrowing of the frame, it is also possible to form a groove 4 made notthrough to the second insulating film 12 in a region where the secondwiring 6 and the like are formed. Or, such a structure may be alsopossible, in which the groove 4 is made through the third insulatingfilm to the second insulating film 12 and some portion of the thirdinsulating film is left to remain partially in the removed area 4E.Further, it is also possible to make the distance L in the removed areagreater than the distance L in the groove 4. Note that it is notnecessary to set the wiring WR1 and the oblique side 41 parallel to eachother, and the distance L in the central portion of the oblique side 41may be greater than the distance L in the end of the oblique side 41.

Next, a modification of this embodiment will now be described.

FIG. 4 shows a first modification according to this embodiment. Ascompared with the structural example shown in FIG. 2 , the firstmodification is different in that the third insulating film 13 is formedup to the region 31 along the substrate end ARA of the array substrateAR. In other words, the removed area 4E of the third insulating film 13is not extended to the substrate end ARA. The spacer PS opposes thethird insulating film 13 formed in the region 31 as in the example shownin FIG. 3 . In the sealant SE, the first seal portion SL1 is formed tobe wider than the second seal portion SL2 as in the case of theabove-provided structural example.

Also in such a modification, an effect similar to that of theabove-provided structural example can be obtained. Further, with thethird insulating film 13 formed along the substrate end ARA of the arraysubstrate AR, it becomes possible to dispose the spacer PS to oppose thethird insulating film 13. With this structure, it becomes possible inthe peripheral area PRP to keep the gap between the array substrate ARand the countersubstrate CT more stably.

FIG. 5 shows a second modification according to this embodiment. Ascompared with the structural example shown in FIG. 2 , the secondmodification is different in that an island 32 of the third insulatingfilm 13 is formed inside the removed area 4E formed in substantially atriangle shape. The spacer PS opposes the island 32 as in the firstmodification. Note that the shape and/or size of the island 32 are notparticularly limited as long as the adhesion area between the groove 4and the removed area 4E and the sealant SE is kept a predeterminedcriterion. Also, not only one, but two or more islands may be provided.Also in such a modification, an effect similar to that of theabove-provided structural example can be obtained.

FIG. 6 shows a third modification according to this embodiment. Ascompared with the structural example shown in FIG. 2 , the thirdmodification is different in that an end opposing the removed area 4E ofthe third insulating film 13 (or the oblique side of the removed area4E) includes a curved portion 33. The curved portion 33 is formed in,for example, a curved shape along the crossing portion CR of the sealantSE. In one example, the curved portion 33 is formed along the locus ofapplying the sealant SE.

Also in such a modification, an effect similar to that of theabove-provided structural example can be obtained. In addition, even ifthe end facing the removed area 4E of the third insulating film 13 has ashape of a comparatively large step equivalent to the thickness of thethird insulating film 13 (for example, 2 μm), it becomes easy to applymore amount of sealant SE on the upper surface of the third insulatingfilm 13 because of the curved portion 33 formed as above. Or even if theapplication location of the sealant SE may vary, it is possible to applythe sealant SE on the upper surface and the removed area 4E of the thirdinsulating film 13 without deviation with the curved portion 33 formedas above. For this reason, it is possible to suppress the reduction ofthe strength of adhesion resulting from the deviation of the sealant SE.

FIG. 7 schematically shows a process of applying the sealant. In oneexample, sealants SE1, SE2 and SE3 are applied on one major surface ofthe first motherboard Ml for forming the array substrate AR (that is theside to which the second motherboard is fixed, which later gives rise tothe countersubstrate CT). Here, the figure illustrates a layout of thesealants for three array substrates. Note that the order of applying thesealants SE1, SE2 and SE3 is not particularly limited.

The array substrate AR1 is formed as it is cut along cut lines CL1 andCL2 in the second direction Y and cut lines CL5 and CL6 of the firstdirection X. The array substrate AR2 is formed as it is cut along cutlines CL2 and CL3 in the second direction Y and cut lines CL5 and CL6 ofthe first direction X. The array substrate AR3 is formed as it is cutalong cut lines CL3 and CL4 in the second direction Y and cut lines CL5and CL6 of the first direction X.

The sealant SE1 is applied in the following manner continuously withoutintermission. That is, in the region of the array substrate AR1, thesealant SE1 is applied, first, along the cut line CL1, then along thecut line CL6 on a side closer to the cut line CL5, and thereafter, alongthe cut line CL2. Continuously, in the region of the array substrateAR2, it is applied along the cut line CL5, and then in the region of thearray substrate AR3, applied along the cut line CL3, then along the cutline CL6 on a side closer to the cut line CL5, and thereafter along thecut line CL4.

The sealant SE2 is applied in the following manner continuously withoutintermission. That is, in the region of the array substrate AR1, thesealant SE2 is applied, first, along the cut line CL5, and then in theregion of the array substrate AR2, applied along the cut line CL2, thenalong the cut line CL6 on a side closer to the cut line CL5, andthereafter along the cut line CL3. Continuously, in the region of thearray substrate AR3, it is applied along the cut line CL5.

The sealant SE3 is applied, in each respective region of the arraysubstrates AR1 to AR3, continuously without intermission in parallel tothe cut line CL6 to be adjacent to the sealant SE1 and sealant SE2. Inother words, the sealing portions formed respectively along the mountunits MT1 to MT3 of the array substrates AR1 to AR3 are formed byapplying the sealant SE twice. When the sealants SE1 to SE3 are allapplied to have a substantially equal width W12, the width W11 of thesealing portions formed along the mount units MT1 to MT3 becomesapproximately twice the width W12. Note that when the application widthof the sealant SE3 is set differently from that of the sealants SE1 andSE2, it is also possible to set the width 11 to be other than twice thewidth W12.

FIG. 8 shows a fourth modification according to this embodiment. Ascompared with the structural example shown in FIG. 2 , the fourthmodification is different in that the void 30 in the crossing portion CRof the sealant SE is not present. That is, the sealant SE is extended tothe substrate end ARA of the array substrate AR in the crossing portionCR. Also in the sealant SE, the first seal portion SL1 is formed widerthan the second seal portion SL2 as in the above-provided structuralexample.

With a modification such as above, an effect similar to that of theabove-provided structural example can be obtained. In addition, thesealant SE of this modification can be formed by a method simpler thanany of the examples provided above. An example of the method of formingthe sealant SE will now be described.

FIG. 9 schematically shows a process of applying the sealant SE. In oneexample, sealants SE4, SE5, SE6, SE7, SE8 and SE9 are applied on onemajor surface of the first motherboard Ml for forming the arraysubstrate AR (that is, the side to which the second motherboard isfixed, which later gives rise to the countersubstrate CT). Here, thefigure shows a layout of the seal materials for three array substrates.Note that the order of applying the sealants SE4, SE5, SE6, SE7, SE8 andSE9 is not particularly limited. The sealants SE4, SE5, SE6, SE7, SE8and SE9 are all applied to have substantially a fixed width W21.

The sealant SE4 is applied along a cut line CL5. The sealant SE4 isformed so that substantially the center of the width W21 thereofcoincides with the cut line CL5. The sealant SE5 is applied along thecut line CL6 on a side closer to the cut line CL5. The sealant SE6 isapplied along a cut line CL1. The sealant SE6 is formed so thatsubstantially the center of the width W21 thereof coincides with the cutline CL1. The sealant SE7 is applied along a cut line CL2. The sealantSE7 is formed so that substantially the center of the width W21 thereofcoincides with the cut line CL2. The sealant SE8 is applied along a cutline CL3. The sealant SE8 is formed so that substantially the center ofthe width W21 thereof coincides with the cut line CL3. The sealant SE9is applied along a cut line CL4. The sealant SE9 is formed so thatsubstantially the center of the width W21 thereof coincides with the cutline CL9.

When the first motherboard Ml illustrated and the second motherboard notillustrated are attached together and then cut along the cut lines CL1to CL6, the sealants SE4, SE6 to SE9 are made to have a width W22 whichis the half of the width W21. On the other hand, in the regions of thearray substrates AR1 to AR3, the sealing portions formed along the mountunits MT1 to MT3 are each formed of the sealant SE5 having the widthW21. That is, the width of the sealing portions formed along the mountunits MT1 to MT3 is substantially twice as large as that of the sealingportions formed along the other three sides. According to such a methodof forming a sealant SE, a sealing portion formed along a mount unit canbe formed wider than the portions along the other sides without applyingthe seal material twice or more.

Note that the sealant SE4 is not necessarily required to overlap the cutline CL5, but the sealant SE4 may be applied along the cut line CL5 on aside closer to the cut line CL5.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

1-10. (canceled)
 11. A display device comprising: a first substratecomprising a first area and a second area; a second substrate comprisinga first substrate end; an organic insulating film formed over the firstarea and the second area; a plurality of pixels arranged in an activearea in the first area; and a mount portion including a plurality ofpads to which either a driver IC or a flexible printed circuit board isto be connected; wherein the first area of the first substrate is anarea where the second substrate opposes the first substrate, the secondarea of the first substrate is an area where the first substrate isexposed from the second substrate, the first substrate end is a boundarybetween the first area and the second area, the organic insulating filmincludes a groove and an opening, the groove is formed outside of theactive area in the first area, the opening is formed at a region wherethe mount portion is arranged in the second area, and the organicinsulating film surrounds the mount portion in the second area.
 12. Thedisplay device of claim 11, wherein the second area of the firstsubstrate comprises a second substrate end, the second substrate end ofthe first substrate is parallel to the first substrate end of the secondsubstrate, and the organic insulating film spreads at a space betweenthe second substrate end of the first substrate and the mount portion.13. The display device of claim 12, wherein the first substratecomprises a long substrate end intersecting the second substrate end ofthe first substrate, and the groove comprises a first portion thatextends parallel to the long substrate end outside of the active area inthe first area.
 14. The display device of claim 13, wherein a pluralityof wirings of wiring group are pulled from the plurality of pads, anoutermost wiring of the wiring group is located between the firstportion and the active area, the outermost wiring is covered by theorganic insulating film in the second area, and the outermost wiringdoes not overlap the first portion in the first area.
 15. The displaydevice of claim 14, wherein the groove comprises a second portion in thefirst area, the second portion is between the active area and the firstsubstrate end of the second substrate, and the second portion extends inparallel to the first substrate end of the second substrate.
 16. Thedisplay device of claim 15, wherein the outermost wiring crosses thesecond portion.
 17. The display device of claim 16, wherein the organicinsulating film in the first area and the organic insulating film in thesecond area are separated from each other by the second portion.
 18. Thedisplay device of claim 13, wherein the organic insulating film spreadsat a space between the long substrate end of the first substrate and themount portion in the second area.
 19. The display device of claim 18,wherein the organic insulating film spreads at a space between the firstsubstrate end of the second substrate and the mount portion in thesecond area.
 20. The display device of claim 17, wherein the organicinsulating film spreads at a space between the long substrate end of thefirst substrate and the mount portion in the second area.
 21. Thedisplay device of claim 20, wherein the organic insulating film spreadsat a space between the second portion and the mount portion in thesecond area.
 22. The display device of claim 11, wherein the groovecomprises a second portion in the first area, the second portion isbetween the active area and the first substrate end of the secondsubstrate, and the second portion extends in parallel to the firstsubstrate end of the second substrate.
 23. The display device of claim22, wherein the second portion of the groove has a first width in adirection intersecting the first substrate end of the second substrate,the opening has a second width in the direction intersecting the firstsubstrate end of the second substrate, and the second width is largerthan the first width.
 24. The display device of claim 22, wherein thesecond area of the first substrate comprises a third substrate end, thethird substrate end of the first substrate is parallel to the firstsubstrate end of the second substrate, and the organic insulating filmspreads at a space between the third substrate end of the firstsubstrate and the mount portion.